en

lead-through hole

1

Terminological databases

Elektroonika terminibaas

ID 1125518 Last modified 12.01.2026
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Domain Electrical Engineering
  • trükkplaati läbiv ühendusava, mis ühendab omavahel trükkplaadi eri kihtidel paiknevaid elektrilisi ühendusi
läbiviikava
via hole
Usage examples
  • A vertical interconnect access (or via) is a plated-through hole in a printed wiring board that is used to route a trace vertically in the board from one layer to another. Vias can be drilled mechanically or with a laser, and they are plated to form electrical connections.
lead-through hole

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