et

läbiviikava

1

Terminological databases

Elektroonika terminibaas

ID 1125518 Last modified 12.01.2026
View dataset
View dataset
Domain Electrical Engineering
  • trükkplaati läbiv ühendusava, mis ühendab omavahel trükkplaadi eri kihtidel paiknevaid elektrilisi ühendusi
läbiviikava
via hole
Usage examples
  • A vertical interconnect access (or via) is a plated-through hole in a printed wiring board that is used to route a trace vertically in the board from one layer to another. Vias can be drilled mechanically or with a laser, and they are plated to form electrical connections.
lead-through hole

Word forms not available

Etymology not available

Related words not available

Search the same word

in the EU's IATE term base
Searching web examples...
Searching translated usage examples...