en

via-in-pad

1

Terminological databases

Elektroonika terminibaas

ID 1152021 Last modified 12.01.2026
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Domain Electrical Engineering
  • tehnoloogia, kus läbiviik paigutatakse otse komponendi ühendusala sisse
  • a technology where the via is placed directly into the pad of a component, rather than in the spaces between pads
via-in-pad
Usage examples
  • Via-in-pad technology creates increased printed circuit board (PCB) routing space on the outer layers, which aids in the routing of complex printed circuit board designs.

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