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tehnoloogia, kus läbiviik paigutatakse otse komponendi ühendusala sisse, a technology where the via is placed directly into the pad of a component, rather than in the spaces between pads
ühendusala läbiviik . Elektroonika terminibaas. Estonian Language Institute, Sõnaveeb 2026. https://sonaveeb.ee/search/unif//elc/%C3%BChendusala%20l%C3%A4biviik/1/est (10.07.2026)
