trükkplaadile kantud kujund, mis väldib jootmisel soojuse hajumist mööda suuri pindu
a technique used to separate soldering pads or plated through-hole vias from large copper planes in order to reduce soldering dwell time by providing thermal resistance during the process, thus minimizing the heat transfer to the plane
Thermal relief is only required for holes that are subject to soldering in large conductor areas (ground planes, voltage planes, thermal planes, etc.).
