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Terminological databases

Elektroonika terminibaas

ID 1125468 Last modified 12.01.2026
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Domain Electrical Engineering
  • ühendab mitmekihilise trükkplaadi sisemisi kihte, ulatumata selle väliskihini
buried via
Usage examples
  • These vias connect only the inner layers of a multilayer PCB. Buried vias do not reach the outer layers and, therefore, do not influence the surface density of pads.

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