en

reflow soldering

1

Terminological databases

Elektroonika terminibaas

ID 1152033 Last modified 12.01.2026
View dataset
View dataset
Domain production lines
  • jootepastal põhinev tööstuslik protsess, mille käigus kinnitatakse ja joodetakse pindliitekomponendid trükkplaadi pinnal olevatele ühendusaladele
  • an industrial process that uses solder paste to attach and melt the surface-mount components onto the pads of a printed circuit board
reflow soldering
Usage examples
  • Reflow soldering is the most widely used method of attaching surface mount components to printed circuit boards.

Materjalitehnika terminibaas

ID 670632 Last modified 06.01.2025
View dataset
View dataset
Domain bonding of metals
  • pehmejoodisjootmine liidetavatele toorikutele eelnevalt peale kantud joodisega (vt pehmejoodisjootmine)
  • a soldering process variation in which two or more parts that have been precoated with solder are reheated and assembled into a joint without the use of additional solder (see: soldering)
sulatusjootmine
sweat soldering preferred
reflow soldering

Word forms not available

Etymology not available

Related words not available

Search the same word

in the EU's IATE term base

Web examples

Online Language Learning Tool SkELL allows users to search for phrases in sentences, collocates and similar words. These examples have been automatically selected and may contain errors.