en

intrusive reflow

1

Terminological databases

Elektroonika terminibaas

ID 1152052 Last modified 12.01.2026
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Domain Electrical Engineering
  • tehnoloogia läbivaukkomponentide jootmiseks trükkplaadile kasutades pindliite tehnoloogiast rakendatavat jootepasta printimist ja taassulatusjootmist
  • a technology for soldering through-hole components onto a printed circuit board using solder paste printing and reflow soldering as applied in surface-mount technology
pin-in-paste
PiP
Usage examples
  • PiP utilizes solder paste printing and the SMT reflow processes to solder through-hole devices.

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